ELANTAS

Sealing

Depending on your individual requirements we offer different search and selection functions to help you find the appropriate material. The listed products are an extract from our actual product portfolio. More products are available on request.

Do you need further information about our adhesives for electronic applications? Please get in touch with us. We are looking forward to your email to bectron.elantas.europe@remove-this.altana.remove-this-also.com.

Product Curing curing conditions

Temp. Range (°C)

Viscosity (Pas)

Tg (°C)

Density (g/cm³)

Description

Bectron® SA 70L1-30

Moisture cure 24h @ RT (25°C/55% RH)-55°C to +200°C441.05one-component system, medium viscosity, self leveling, translucent
Bectron® SA 70P1-15 Moisture cure 24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste1.03one-component system, thixotropic paste, translucent
Bectron® SA 70P1-30 Moisture cure 24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste1.08one-component system, thixotropic paste, translucent
Bectron® SA 70P1-34 Moisture cure 24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste1.50one-component system, thixotropic paste, white
Bectron® SA 70P9-37 Moisture cure 24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste1.50one-component system, thixotropic paste, black
Bectron® SA 70P9-60 Moisture cure 24h @ RT (25°C/55% RH)-55°C to +200°Cthixotropic paste1.25one-component system, thixotropic paste, black

Bectron® SA 70V1-36

Moisture cure 24h @ RT (25°C/55% RH)-55°C to +200°C3.21.04one-component system, low viscous, self leveling,  translucent