ELANTAS Electrical Insulation


In principle, the resin component should be carefully stirred at the beginning of processing. The resin compound is generally prepared and processed under normal pressure. Adherence to the mixing ratio and intensive mixing are thus important since otherwise variations in the mechanical and dielectric properties of the cured potting resin can occur. The potting method uses a “pot”, case or shell to put the device in and then pour the liquid potting compound to the top of the case covering the device and completely encasing it. The case becomes part of the finished unit. This is the most common method used, especially for high speed and many-units-per-hour production-line conditions. 

The potlife of the resin compound at room temperature is restricted. It can only be increased to a certain extent by cooling, in conjunction with a corresponding increase in viscosity.

The resin compound cures without the addition of heat at room temperature. However, if the casting resin volume is small, a combined cold/warm curing process is recommended, e.g. for 2 - 6 hours at room temperature and with subsequent casing hardening for 2 - 4 hours at 60 -80°C.